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Electrical Connections
Footprint
Actual size footprint:
1
8
Terminal
Connection
Number
2
7
1
2
3
4
5
6
7
8
LID
Case Design
V CC
Ground
NC or Ground
Q Output
Q Output
Ground
ENABLE
Ground
3
4
TOP VIEW
6
5
Typical Printed Circuit Board Land Pattern
A typical land pattern for a circuit board is shown below. Grounding of the
metallic center pad is optional.
Typically 0.01" to 0.05" or 0.25 mm to
1.25 mm (8 Places)
All pads consist of 30 microinches (min) electroless gold on 50 microinches
(min) electroless nickel over base metal. The metallic center pad was
designed for mechanical support. Grounding of this pad is optional.
Lid symbolization, including terminal 1 locator dot, are in contrasting ink.
Symbolization varies by model number. For purposes of illustration, only
terminal 1 dot is shown.
.
Typical Test Circuit
(The optimum value of this dimension is
dependent on the PCB assembly process
employed.)
B
C
D
E
V cc
0.1 μ F
Sine-Wave
Tektronix
N (X8)
F (X8)
4.7 μ H
Signal Generator
CSA 803
Digitizing
A
M
L
G
(X3)
H (X2)
V cc
Clock
Under Test
Q
Q
50 Ω
50 Ω
*
*
Oscilloscope
Ch 1
Trigger
Ch 2
K
J
ENABLE
Timing Definitions
50 Ω
*Power Splitter, Mini-Circuits ZFSC2-4
Dimensions
Millimeters
Inches
Propagation Delay:
Min
Max
Min
Max
A
13.46
13.97
0.530
0.550
ENABLE
B
9.14
9.66
0.360
0.380
50%
50%
C
2.05 Nominal
0.081 Nominal
D
E
F
G
H
J
3.56 Nominal
2.24 Nominal
1.27 Nominal
2.54 Nominal
3.05 Nominal
1.93 Nominal
0.141 Nominal
0.088 Nominal
0.050 Nominal
0.100 Nominal
0.120 Nominal
0.076 Nominal
Q or Q Output
Amplitude
Envelope
t PD
90%
t PD
10%
K
L
5.54 Nominal
4.32 Nominal
0.218 Nominal
0.170 Nominal
Symmetry:
Q or Q Output
M
4.83 Nominal
0.190 Nominal
50%
50%
50%
N
0.50 Nominal
0.020 Nominal
Symmetry as
% of Period
Period
Symmetry as
% of Period
www.RFM.com E-mail: info@rfm.com
?2008 by RF Monolithics, Inc.
Page 2 of 2
SC3038B - 3/27/08
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